CHINA TOPIX

New LeEco Le2 Leak Reveals Metal Body, Snapdragon 821 Chipset

Phenny Lynn Palec   |

Aug 26, 2016 04:37 PM EDT

A handful of new photos believed to be that of the upcoming LeEco Le2 flagship smartphone were recently spotted on Chinese social networking platform Weibo. The photo reveals the full metal build of the device, with a fingerprint scanner located on the back. There are also rumors that the smartphone would have a powerful Qualcomm Snapdragon 821 chipset under its hood.